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Newsletter - 3I810DW
Completed Intelligent Appliance with
8th Intel® Whiskey Lake-U SoC Processor

LEX SYSTEM latest 3.5” SBC 3I810DW is with 8th Gen. Intel® Whiskey Lake-U i7/i5/i3/Celeron processor, integrated 5 x GbE LAN, 7 x USB, 2 x COM and 2 x HDMI & eDP display interface & plus with wide range+9~36V DC input that offers the ideal platform for high performance applications in AI, Smart Automation, Machine Vision, In-vehicle , Industry 4.0 and any compact high-performance Internet of Things (IoT) applications.

3I810DW  
Next Gen. solution for Intelligent Appliance
8th Intel® Whiskey Lake-U i7 /i5 /i3 /Celeron  SoC CPU / chipset
2 x DDR4  SODIMM socket, max. up to 32GB
Display Interface: 2 x HDMI, eDP
5 x Intel (1x I219LM+4xI210 IT) GbE, 4x USB 3.1,
3 x USB 2.0, 2 x COM (RS232/422/485), 8DI/8DO
2 x Mini PCIe,1 x M.2 B Key Type 2242, 1 x Nano SIM
TPM 2.0 (Optional)
Wide Range DC-IN 9~36V
Wide temperature support of -20°C ~ 70°C
 
 
  TASK  
Dimension: 77 H x 210W x 125D mm
• Super Excellent heat-dissipating System
• Robust & Powerful Fanless Embedded solution
 
 
 
 
 

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