Home > Products > DIN-Rail mounted > MIRO-3 (2 Layers)
 
Embedded Fanless System / DIN-Rail for 3.5"SBC
MIRO-3 (2 Layers)
DIN-Rail Mounted Embedded Series
Facility monitoring / Automation control / Transportation
Features
Excellent heat-dissipating DIN-Rail mounted System
 
3I170DW
3I610DW
3I380NX
3I610CW;
3I610DW
3I170DW
 
MODEL MIRO-3 (2 Layers)
DIN-Rail Mounted Embedded Series
Dimension 72.9 H x 178 W x 116D mm
Material Aluminum
Color Silver
Weight 1.5 Kg ( Incl. M/B )
Storage Space 1 x 2.5" HDD
Optional Accessory DIN-Rail mounted kit. (Option)

 

M/B information: ( Please refer to M/B specification )
CPU Type M/B Model VGA DVI / HDMI COM LAN USB Audio Operation Temp
SDD HDD
Intel® Skylake-U Core i CPU
3I610DW
N/A 2 x HDMI 2 5 4 DI/O,
Nano SIM
70ºC
Intel® Bat-Trail E3825 / E3845 / J1900
3I380A / CW
1 HDMI 4 2 4 Line out / Mic-in 70ºC
Intel® Ivy Bridge 1047 UE 1.4GHz, i3, i7
3I847CW
1 DVI & HDMI 3 2 4 Line out / Mic-in 70ºC
3I847NX
1 HDMI 2 1 +
4 x PoE
3 Line out / Mic-in 70ºC
 
More Functions
3G / 4G Wi-Fi GPS 1 ~4 Video-IN
Optional LAN Parallel Port COM DIO
The above available functions outline the possibility with system, for more information please contact us.