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Embedded Single Board Computers
3I612DW
3.5" SBC supports 6th / 7th Gen Intel® Skylake-U / Kaby Lake-U CPU DP, HDMI, eDP, 5 x Intel Gb Ethernet, 2 x SFP Fiber, 1 x M.2 4DI / 4DO, 8 x USB, 2 x COM, 2 x Mini PCIe, 1 x Nano SIM
Features
6th / 7th Gen Intel® Skylake-U / Kaby Lake-U, i7 / i5 / i3 / Celeron CPU
2 x DDR4 SODIMM socket, Max. 32GB
Multiple Independent display: DP, HDMI & eDP
5 x Intel GbE LAN, 2 x Fiber, 4 x USB 3.0, 4 x USB 2.0
2 x COM, 4DI / 4DO, 1 x M.2, 2 x Mini PCIe, 1 x Nano SIM
TPM 2.0 (Optional)
 
 
MODEL 3I612DW
CPU 6th / 7th Gen Intel® Skylake-U / Kaby Lake-U, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Skylake-U / Kaby Lake-U SoC
Graphics Intel® HD Graphics, Support DirectX 12 & OpenGL 4.4 / 4.5
System Memory 2 x DDR4 1866 / 2133 MHz SODIMM, Max. 32GB
Storage 1 x mini card socket for mSATA
1 x M.2 B Key,Type 2242 (mSATA)
1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s), Share with mSATA
BIOS Insyde UEFI BIOS
Display 1 x DP, 1 x HDMI, eDP
TPM TPM 2.0 (Option)
LAN 1 x Intel GbE I219LM (external), 4 x Intel GbE I210IT (external)
Fiber 2 x Intel I210IS Fiber 10 / 100 / Giga bit
Audio High Definition Audio Specification, Support Line-out / Mic-in / Line-in
Two channel Class D Audio Amplifier
Expansion Interface 1 x Full size Mini PCIe (PCIe / mSATA / USB)
1 x Full size Mini PCIe (PCIe / USB 2.0-optional USB 3.0)
1 x M.2 B Key, Type 2242 (mSATA)
1 x Nano SIM
Expansion Module Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video
By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card
USB 4 x USB 3.0 (external) ; 4 x USB 2.0 (internal)
Serial IO 2 x RS232 / 422 / 485 (internal)
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
Power Input Wide Range +12~48V
Dimension 190 x 112 mm
Operation Temperature -20°C~70°C (100 % CPU Usage)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: SKY 3, TINO, Rackmount (1U OEM)