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APOLLO High Performance Fanless Embedded Computers / Stackable configuration Box PC for CPU board & PCIe Backplanes / Flexibility I/O / expansion PCIe x 1, PCIe x 4, PCIe x 8, PCIe x 16
APOLLO + PM170DW System
6th/7th Gen Intel® Celeron®, i3, i5, i7 with Q170 Chipset,
DDR4 SODIMM, Max up to 32GB,
4 x GbE, 3 x COM,VGA, HDMI, 4 x USB,
1 x M.2 B Key, 2 x SIM, 12~24V DC input
Features
6th/7th Gen Intel® Celeron®, i3, i5, i7 with Q170 Chipset
Fanless design -20°C to +50° (100% CPU usage)
mSATA / SATA / M.2,
Optional 2/4 x Mobile Rack or
2/4 x CFast by OEM demand
12~24V DC input
Flexibility expand function for 4~8 PoE/LAN,
WiFi, 4G LTE, GPS, Isolated COM, CANBus
LVDS & Touch screen control
vPro @ TPM2.0
VESA mount design
 
 
MODEL APOLLO + PM170DW
System Dimension (WxDxH) 260 W x 142.5D x 173H mm
Weight (Incl.M/B) 4.2 kg
CPU Intel Skylake-S / Kaby Lake-S i7, i5, i3 Celeron CPU
Chipset Intel® Q170
Memory Type / Capacity DDR4 2133 MHz, Max up to 32GB
SO-DIMM 2
SSD storage mSATA YES
Storge Space mSATA, SSD*, M.2 B Key
VGA / DP VGA
HDD / DVI HDMI
USB 4 x USB 3.0
COM 3
PCI / PCIe 2 x Slots (PCIe x 16 + PCIe x 4)
Mini-PCIe 1 x Full size Mini card for PCIe / mSATA / USB
1 x Full size Mini card for PCIe/USB
SIM Card Holder 2
GPIO 16DI / 16 DO (option)
Ethernet 4 x Intel GbE
Power Input Wide Range DC IN +12~24V
Expansion 3G / 4G,GPS, Bluetooth, WI-FI
Operating MB N/A
Operating Temp. -20ºC~50ºC for mSATA / SSD
(100% CPU Usage)
Operating Humidity 5~95% @ 60ºC, non-condensing