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Embedded Fanless System / DIN-Rail for 3.5"SBC
MIRO-3 (3 Layers)
DIN-Rail Mounted Embedded Series
Facility monitoring / Automation control / Transportation
Features
Excellent heat-dissipating DIN-Rail mounted System
 
3I170DW
3I610DW
3I380NX
3I610CW;
3I610DW
3I170DW
 
MODEL MIRO-3 (3 Layers)
DIN-Rail Mounted Embedded Series
Dimension 90.9 H x 178 W x 116D mm
Material Aluminum
Color Silver
Weight 1.75 Kg (Incl. M/B)
Storage Space 1 x 2.5" HDD
Optional Accessory DIN-Rail munted kit. (Option)

 

M/B information: ( Please refer to M/B specification )
CPU Type M/B Model VGA DVI / HDMI COM LAN USB Audio Operation Temp
Industry mSATA Industry SSD
Intel® Skylake / Kaby Lake i3 / i5 / i7 Celeron CPU
3I610CW
1 DVI 6 2 4 - 60ºC -
Intel® Bat-Trail E3825 / E3845 / J1900
3I385AW/CW
1 DVI 6 2 4 - 70ºC 70°C
3I380A/CW
1 HDMI 6 2 4 Line out / Mic-in 70ºC 70°C
Intel® Ivy Bridge 1047 UE 1.4GHz, i3, i7
3I847CW
1 DVI & HDMI 5 2 4 Line out / Mic-in 70ºC 70°C
3I847NX
1 HDMI 2 1 + 4 x PoE 3 Line out / Mic-in 70ºC 70°C
 
More Functions
3G / 4G Wi-Fi GPS 1 ~4 Video-IN Optional LAN
Parallel Port DC +9V~+36V DIO COM
The above available functions outline the possibility with system, for more information please contact us.