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Rich Expansion for Vertical Application with LEX eIO solution
  eIO extension SBCs with multi-function extension cards provide
faster development schedules in an efficient and cost-effective way.
      LEX eIO extension solutions cover 3.5" SBC, Pico-ITX SBC, various expansion modules, as well as full systems for complete embedded solutions.
 
Apollo Lake Platform SBC:
2I390CW  
Compact solution with Rich Expansion for
vertical application
 
Intel® Apollo Lake N4200 / N3350 / E3950 SoC CPU / chipset
On board DDR3L 4GB
Display: eDP, HDMI & DVI
2 x GbE, 2 x Mini PCIe, 2 x USB 3.0, 3 x USB 2.0
4DI/4DO, HD audio, 2 x COM,
Lex eIO: 2 x PCIe + USB
Wide Range DC IN +9~36V
Wide temperature support of -20°C ~ 70°C
Support 4K UHD resolution content
 
 
2I392CW  
Compact solution with Rich Expansion for
vertical application
 
Intel® Apollo Lake N4200 / N3350 / E3950 SoC CPU / chipset
1 x DDR3L 1600 Mhz SODIMM, Max up to 8GB
Display: LVDS & 2 x HDMI (option 2 x Display Port)
2 x GbE, 2 x Mini PCIe, 4 x USB 3.0, 3 x USB 2.0
2 x COM (3 in 1 RS232/422/485 select by BIOS)
4DI/4DO, HD audio, Lex eIO: 2 x PCIe + USB
Wide Range DC IN +9~36V
Wide temperature support of -20°C ~ 70°C
Support 4K UHD resolution content
 
 
Bay Trail Platform SBC:
2I385EW  
Compact solution with Rich Expansion for
vertical application
 
Intel® Bay Trail E3825 /E3845/J1900
(Dual Core/Quad Core) SoC CPU / chipset
On board DDR3L 2GB / 4GB
Display: VGA
2 x GbE, 2 x Mini PCIe, 4 x USB 2.0
2 x COM (3 in 1 RS232/422/485 select by BIOS)
4DI/4DO, HD audio, 4 x COM,
Lex eIO: 2 x PCIe + USB
Wide Range DC IN +9~36V
Wide temperature support of -20°C ~ 70°C
 
 
2I386EW  
Compact solution with Rich Expansion for
vertical application
 
Intel® Bay Trail E3845/J1900 (Quad Core) SoC
CPU / chipset
1 x DDR3L 1333Mhz SODIMM, max up to 8GB
Display: VGA & LVDS
2 x GbE, 2 x Mini PCIe, 1 x USB 3.0, 3 x USB 2.0
4 x COM (COM1/COM2: 2 x RS232 / RS422 / 485)
(COM3/COM4: 2 x RS232)
4DI/4DO, HD audio, Lex eIO (2 x PCIe + USB), Touch, Audio AMP
Wide Range DC IN +9~36V
Wide temperature support of -20°C ~ 70°C
 
 
Skylake-U/Kaby Lake-U Platform SBC:
3I610DW  
Complete solution for Networking & IoT Applications
Intel® Skylake-U/Kaby Lake-U i7 /i5 /i3 / Celeron SoC CPU / chipset
2 x DDR4 SODIMM socket, max. up to 32GB
Display Interface: 2 x HDMI, eDP
5 x Intel (4 x I210 IT + 1 x I219LM) GbE,
2 x Mini PCIe, 1 x Nano SIM
7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0)
HD Audio
2 x COM (RS232/422/485)
4DI/4DO, HD audio, Lex eIO: PCIe + USB
Wide Range DC IN +9~36V
Wide temperature support of -20°C ~ 70°C
TPM 2.0 / vPro
 
 
LEX eIO extension card:
  L2L001
5 PCIe Giga LAN
Intel I210-IT / I211-AT
1 Mini PCI Express socket.
USB and PCIe (Option, share fifth LAN port)
SIM-Push-Push
Dimension: 102 x 73mm
 
  L2L002
4 PCIe Giga LAN
Intel I210-IT / I211-AT
1 port 1000Base-SX Fiber.
1 Mini PCI Express socket.
USB and PCIe (Option, share Fiber LAN port)
SIM-Push-Push
Dimension: 102 x 73mm
 
  L2L003
4 x PoE Giga LAN, 1 x Fiber LAN
Power: Wide Range +9V ~+36V
Dimension: 102mm x 73 mm
 
  L2L004
2 x PoE Giga LAN M12 type
1 x Fiber LAN(Optional)
1 x Full Size Mini card USB interface
1 x SIM socket
Power: Wide Range +9V ~+36V
Dimension: 102mm x 73 mm
 
  L2M001
4 Mini PCI Express socket (full size).
Support USB and PCIe, SIM-Push-Push
For option: USB 3.0 x 2
Dimension: 117 x 73mm
 
  PW501
Input: DC IN 18V~36V / DC IN 18V~75V / DC IN 9V~36V
Output: 4 x +12V DC output (Optional to 24V DC output)
Power: 120W
Dimension: 73 x 45 mm (power board size)
 
  PW502
Input: DC IN 18V~75V / DC IN 16.8V~137.5V / DC IN 9V~36V
Output: 4 x +12V DC output (Optional to 24V DC output)
Power: 200W
Dimension: 102 x 73 mm (power board size)
 
  PW503
Input Voltage: 43V~160V
Output: 5 x +12V DC output
Isolation voltage: 3000V
Power: 200W
Dimension: 102 x 73 mm (power board size)
 
Pico Express® Embedded Fanless System:
  TERA Series  
Dimension: 56.5H x 145W x 106.2D mm
• Compact heat-dissipating System
• Robust & Powerful Fanless Embedded solution
 
  MIRO-2 Series  
Dimension: 72 H x 140 W x 92 D mm
• Industrial networking solution
• Powerful Fanless Din-Rail solution
 
  BLADE Series  
Dimension: 63 H x 150 W x 80.8 D mm
• Compact heat-dissipating System
• Robust & Powerful Fanless Embedded solution
 
  TASK Series  
Dimension: 77H x 210W x 125D mm
• Super Excellent heat-dissipating System
• Robust & Powerful Fanless Embedded solution
 
 
 
 

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