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| Flexible IO expansion with 3.5” |
| Intel® Skylake-S / Kaby Lake-S Platform |
| LEX launches 3I170HW SBC with Intel® Skylake-S / Kaby Lake-S processor to give users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, military and IP surveillance solutions. |
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| 3I170HW |
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| ideal solution for Industry 4.0 Applications |
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Intel® Skylake-S / Kaby Lake-S i7/i5/i3/ Celeron CPU |
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Intel Q170 chipset |
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2 x DDR4 SODIMM socket, max. up to 32GB |
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Display Interface: HDMI, VGA & LVDS |
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5 x Intel (4 x I210 IT + 1 x I219LM) GbE,
1 x Mini PCIe, 1 x SIM |
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9 x USB (2 x USB 3.0/2.0 + 7 x USB 2.0),
2 x COM (RS232/422/485) |
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8DI/8DO, HD audio, 1 x M.2 B key,
Touch Screen controller |
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Wide Range DC IN +9~36V |
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Operation temperature 0°C ~ 60°C |
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