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                | Maximizing performance 3.5” SBC  with Intel® 9th/8th gen Coffee Lake-S Core™ processor
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                | LEX  SYSTEM 3I370DW, with latest Intel 9th/8th Gen Coffee Lake-S Core i CPU, equipped with 5 x GbE, 6  x RS232/RS422/485 serial ports, 8 x USB, 16 DI /16 DO, DP, HDMI & eDP and  PCIe/mPCIe/M.2  expansion slots, is ideal  platform to integrate diagnostic test tools and control equipments for video surveillance, vehicle communication and industrial IoT automation  applications. 
 3I370DW provides the option of horizontal & vertical  type memory SODIMM socket for flexible implementing with heat-spreading requirement. Furthermore, APOLLO-S & APOLLO-RS  3I370DW mechanical design provide rugged and scalable computing  platforms that support installing graphics card  which benefit the implementation of advanced AI applications such as  machine learning, autonomous vehicle, intelligent video analytics, facial recognition.
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                        | 3I370DW |  |  
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                            | 3I370DW – Completed solution for AI & Industry 4.0 Applications
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                              | • | Intel®  9th /8th Gen Coffee Lake-S, i9 (35W) /i7 / i5 / i3 / Pentium/ Celeron CPU |  
                              | • | Intel®  Q370 Chipset |  
                              | • | 2 x  DDR4 SODIMM socket, Max. 64GB |  
                              | • | Multiple  Independent display: HDMI, DP & eDP (eDP to VGA and DVI  converter)
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                              | • | 5 x  Intel GbE LAN, 4 x USB 3.1,4 x USB 2.0, TPM2.0 |  
                              | • | 1 x Full size Mini PCIe (PCIe /mSATA /USB 3.0 /USB2.0) |  
                              | • | 1 x M.2 B Key, Type 2242 (Support NVME) |  
                              | • | 1 x PCIe 16x golden finger |  
                              | • | 6 x  RS232/422/485 (internal) – Optional to DIO port |  
                              | • | 16  DI/ 16 DIO-Optional to Serial Port |  
                              | • | Wide  Range DC Input +12~36V |  
                              | • | Wide  Range temperature support -20 °C  ~ 60°C |  
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                        | Dimension : 230 x 99 x 173 mm |  
                        | • Excellent heat-dissipating System |  
                        | • Robust & Powerful Fanless Embedded solution |  
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                    | Dimension : 230 x 109 x 173 mm |  
                    | • Super Excellent heat-dissipating System |  
                    | • Robust & Powerful Fanless Embedded solution |  
                    | • Support 1x PCIe Slot expansion |  
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                | Extension Cards |  
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                    |  | RS804 : Riser card for PCIe to 1 x PCIe Slot PCIe (x16) interface to 1 x PCIe Slot ( PCIe x16)Riser Card for Apollo-RS 3I370DW
 110 x 45 mm
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                    |  | E694A : 4 x PoE 802.3 AF/AT PCIe x 4 Compliant  
                          4 x Intel I210 IT Chipset
 120 x 101 mm
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                    |  | PW502 : Wide range Power board & Power Supply Input Voltage: 18V~75V, 9V~36V or 16.6V~154V
                          Output: 4 x +12V DC output (Optional to 24V)
 Operating base plate temperature -40ºC to +100ºC
 Isolation voltage: 3000V
 Power: 200W
 102 x 73 mm
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