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| Flexible IO expansion with 3.5” |
| Intel® Skylake-U / Kaby Lake-U SoC platform |
LEX launches 3I610BW/3I610HW SBC with Intel® Skylake-U / Kaby Lake-U SoC processor to give users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis.
The battery charger feature makes this platform well suited for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, ATM machines, medical / hospital station and warehouse solution. |
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| 3I610BW/3I610HW |
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| Completed solution for Smart City Applications |
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Intel® Skylake-U/Kaby Lake-U i7/i5/i3 / Celeron SoC CPU / chipset |
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2 x DDR4 SODIMM socket, max. up to 32GB |
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Display Interface: HDMI, VGA & LVDS |
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3 x Intel (2 x I210 IT + 1 x I219LM) GbE,
2 x Mini PCIe, 1 x SIM |
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7 x USB (4 x USB 3.0/2.0 + 3 x USB 2.0), HD Audio,
6 x COM (RS232/422/485) |
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16DI/16DO, HD audio |
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Battery Charger function |
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Wide Range DC IN +9~36V |
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Wide temperature support of -20°C ~ 70°C |
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| Waterproof solution with 3.5” |
| Intel® Skylake-U / Kaby Lake-U Platform |
| IP67 waterproof solution is equipped with ultra compact 3I610BW/3I610HW with excellent heat-dissipating function and fanless design, which is capable of supporting waterproof connectors (M12 type) with function of VGA, USB, Serial Port and LAN. |
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| Dimension: 250W x 168D x 40H |
| • Compact size Fanless Solution |
| • IP67 waterproof solution |
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| • Touch Screen panel |
| • Bezel free mechanical design |
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