3I612DW  
hard-hitting connectivity via Fiber & Ethernet Network
Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 / SoC CPU / chipset
2 x DDR4 SODIMM socket, max. up to 32GB
Display Interface: HDMI, DP & eDP
5 x Intel (4 x I210 IT + 1 x I219LM) GbE, 2 x SFP Fiber (I210 IS)
8 x USB (4 x USB 3.0 / 2.0 + 4 x USB 2.0), HD Audio, 2 x COM (RS232 / 422 / 485)
4DI / 4DO, 2 x Mini PCIe, 1 x Nano SIM, 1 x M.2 B Key
Wide Range DC IN +12~48V
Operation Temp: -20°C~70°C (100% CPU Usage)
 
  TINO  
• Dimension:68H x 245W x 177D mm
• Super Excellent heat-dissipating System
• Robust & Powerful Fanless Embedded solution
 
  1U  
• Dimension: 44H x 230W x 215D mm
• Support 1U rack mount
• Robust & Powerful Embedded solution
 
 
 
For more product information or pricing, please contact our sales representative as below based on your location:
 
Taiwan Headquarters
LEX Computech Co. Ltd
 
Tel: 886 2 2228-1055
Fax: 886 2 2228-1056
Email:
lex.sales@lex.com.tw
www.lex.com.tw
Europe Sales representative
LEXCOM B.V.
 
Tel: 31 73 687-2390
Fax: 31 73 687-2398
Email:
info@lex.com.tw
www.lex.com.tw
Russia Sales representative
LEX Computech Co. Ltd
 
Tel: 7 906 082-8862

Email:
anton@lex.com.tw
www.lex.com.tw
China Sales representative
LEX Computech Co. Ltd
 
Tel: 86 29 8623-9340
Fax: 86 29 8623-9340
Email: robin@lex.com.tw
www.lex.com.tw
 
Copyright © 2016 LEX Computech Co., Ltd.    All rights reserved.
Design and specifications are subject to change without prior notice.
Any type of unauthorized reproduction is prohibited.