|
 |
|
 |
 |
|
| 3I810DW |
|
| Next Gen. solution for Intelligent Appliance |
| • |
8th Intel® Whiskey Lake-U i7 /i5 /i3 /Celeron SoC CPU / chipset |
| • |
2 x DDR4 SODIMM socket, max. up to 64GB |
| • |
Display Interface: 2 x HDMI, eDP |
| • |
5 x Intel (1x I219LM+4xI210 IT) GbE, 4x USB 3.1, |
| • |
3 x USB 2.0, 2 x COM (RS232/422/485), 8DI/8DO |
| • |
1 x Mini PCIe, 2 x M.2 B Key support NVME |
| • |
TPM 2.0 (Optional) |
| • |
Wide Range DC-IN 9~36V |
| • |
Wide temperature support of -20°C ~ 70°C |
| |
 |
|
|
 |
|
|
|
| Dimension: 77 H x 210W x 125D mm |
| • Super Excellent heat-dissipating System |
| • Robust & Powerful Fanless Embedded solution |
| |
|
| |
 |
|
 |
|
|
|
