Home > News & Events > Newsletter- 3I170HW
Newsletter - 3I170HW
Flexible IO expansion with 3.5”
Intel® Skylake-S / Kaby Lake-S Platform
     LEX launches 3I170HW SBC with Intel® Skylake-S / Kaby Lake-S processor to give users fast, convenient and simplified solutions for industrial and embedded applications. This platform with all wafer IO design delivers high flexibility toward expanded functions and also provides user hassle-free solution of integrating the SBC board at various mechanical chassis for many reliability and mobility constrained embedded applications, such as Automation Control, Transportation, military and IP surveillance solutions.
ideal solution for Industry 4.0 Applications
Intel® Skylake-S / Kaby Lake-S i7/i5/i3/ Celeron CPU
Intel Q170 chipset
2 x DDR4 SODIMM socket, max. up to 32GB
Display Interface: HDMI, VGA & LVDS
5 x Intel (4 x I210 IT + 1 x I219LM) GbE,
1 x Mini PCIe, 1 x SIM
9 x USB (2 x USB 3.0/2.0 + 7 x USB 2.0),
2 x COM (RS232/422/485)
8DI/8DO, HD audio, 1 x M.2 B key,
Touch Screen controller
Wide Range DC IN +9~36V
Operation temperature 0°C ~ 60°C