导轨式系统
MIRO 3 - 3I610DW (2 Layer)
Fanless Embedded Computer with 6th/7th Gen
Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 processor
Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 processor
特点
- 6th / 7th Gen Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 CPU
- 2 x DDR4 SODIMM socket, Max. 64GB
- 5 x GbE, 2 x COM, 2 x HDMI, 4 x USB
- Wide Range 9~36V DC input
- 2 x Mini PCIe, 1 x Nano SIM
- DIN Rail mountable (with optional Kit)
| MODEL | MIRO 3-3I610DW (2 Layer) | |
|---|---|---|
| System Dimension(WxDxH) | 178W x 116D x 72.9H mm | |
| Weight(Incl.M/B) | 1.5 kg | |
| CPU | Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 CPU | |
| Chipset | Intel Skylake-U / Kaby Lake-U SoC | |
| Memory | 2 x DDR4 SODIMM socket, Max. 64GB | |
| Storage | mSATA, HDD / SSD* | |
| Expansion slots | 1 x Full-size Mini PCIe (USB / mSATA) 1 x Full-size Mini PCIe (PCIe / USB 3.0 / USB 2.0) 1 x Nano SIM |
|
| I/O ports | Network | 5 x Intel GbE |
| USB | 4 x USB 3.0 | |
| Serial ports | 2 x COM | |
| Display | 2 x HDMI | |
| GPIO | DI / DO (optional) | |
| Optional Modules & Accessory |
GPS, Bluetooth, WiFi, 4G LTE, DI/O, Isolated COM *VESA Mount Kit, *DIN Rail Mounting Kit *Wall Mount Kit, *SATA Kit *External Power Adapter |
|
| Power | DC input : +9~36V AC input : External adapter 100 / 240V |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C (Celeron 3955U) -20°C to +50°C (Core i5 6300U) -20°C to +50°C (Core i7 6600U) -20°C to +50°C (Core i3 6100U) *W / Industrial SSD |
|
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
| OS Support |
7th Generation Intel® Core™ Processor family: Kaby Lake Windows® 10 IOT (64bit), 6th Generation Intel® Core™ Processor family: Skylake Windows® 10 IOT (64bit), Windows® 8.1 (64bit), Windows® Embedded 8 Standard (64bit), |
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