导轨式系统

ROCK-2I110D

Compact Fanless Embedded Computer
with 11th Intel® Tiger Lake-UP3 Processor

概览

ROCK 2I110D 是一款坚固耐用的无风扇 DIN 导轨计算机,尺寸仅为 173W x 130D x 85H mm。它采用第 11 代英特尔® Tiger Lake-UP3 i7/i5/i3/Celeron 处理器,旨在提供强大的边缘 AI 解决方案。ROCK 2I110D 配备多个 I/O,例如 HDMI、4 x 2.5 Gb 以太网端口、3 x USB 3.2 端口、2 x USB 2.0 端口和 2 x COM 端口以及可选的隔离数字 I/O,用于工业通信和控制。此外,通过采用 M.2 插槽,ROCK 2I110D 可以充分利用 WiFi 6、4G/5G 无线通信的带宽,为 AIoT 和边缘网关应用提供广域覆盖和实时数据传输。
高性能以及紧凑坚固的机械设计等特性也使 ROCK 2I110D 成为视觉检查、视频分析、智能交通、智能工厂、智能医疗应用项目的理想边缘 AI 解决方案,这些项目需要在恶劣环境下进行高级计算。

 

 

特点

  • 11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
  • 1 x DDR4 SODIMM socket, Max. 32GB
  • Independent display: HDMI®
  • 4 x Intel GbE LAN, 3 x USB 3.2, 2 x USB 2.0, 2 x COM
  • 2 x M.2, 1 x Nano SIM, DI/O
MODEL ROCK-2I110D
Motherboard 2I110D
Dimension(WxDxH) 173W x 130D x 85H mm
Weight(Incl.M/B) 2.2 kg
Mounting DIN Rail Mount*, Wall Mount *VESA Mount
CPU 11th Gen Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
Chipset Intel Tiger Lake-UP3 SoC
Memory 1 x DDR4 SODIMM socket, Max. 32GB
Storage M.2-SSD*
Expansion slots 1 x M.2 B key Type 3042 (PCIe x2 / USB 3.2 / 2.0)
1 x M.2 M key Type 2242 (PCIe x4 / SATA), Support NVMe
I/O portsNetwork 4 x Intel GbE
USB 3 x USB 3.2, 2 x USB 2.0
Serial ports 2 x RS232 / 422 / 485
Display 1 x HDMI®
SIM 1 x Nano SIM (M.2 B key)
DIO 4DI / 4DO (option)
Optional Modules
& Accessory
GPS, Bluetooth, PoE, WiFi, 4G / 5G LTE, Isolated COM, battery UPS, DI/DO, Video Input
*Wall Mount Kit, DIN Rail Mounting Kit* VESA Mount Kit
Power

DC input : +12V
AC input :  External adapter 100 / 240V
AC-DC 60W (optional)

Operating Temp.
(100 % CPU usage)
-20°C to +60°C (Core i7 1185GRE)
Storage Temp. -20°C to +70°C
Relative Humidity 95% @ 40°C, non-condensing
Certification CE / FCC class A
OS Support Windows® 10 IOT (64bit), Ubuntu 18.04.2 above, Fedora 29 above