ARM 기반 SBC
NXP-HAI03
on Module: NEX-8MP
개요
The LEX SYSTEM ultra-compact carrier board NXP-HAI03, powered by the NXP i.MX 8M Plus and Hailo-8™ AI processor, redefines embedded computing by delivering up to 26 TOPS of AI performance for edge applications. It features Mini HDMI®, 4/8GB LPDDR4 memory, 32–256GB eMMC, Micro SD, and MIPI-CSI for camera input. The board is equipped with I/O interfaces, including 2 GbE LAN, USB 3.0, and 1 internal COM port, and supports a 9-24V wide-range power input for demanding applications.
The modular architecture of the NXP-HAI03 streamlines development, shortens time-to-market, and optimizes costs. Designed for harsh environments, it is the ultimate solution for applications requiring reliable and high-performance edge computing, such as object detection, image recognition, and predictive maintenance.
특징
- NXP i.MX8M Plus (Quad core) ARM Cortex-A53
processor up to 1.8 GHz (NEX-8MP) - LPDDR4, 4 / 8GB (NEX-8MP)
- 32 GB eMMC 5.1 (NEX-8MP), expandable to 256GB ;
1 x Micro SD - Onboard Hailo-8™ AI processor ; 2 x MIPI-CSI
- 1 x Mini HDMI® ; 2 x GbE (RJ45) ; 1 x USB 3.0 Type A,
1 x USB 3.0 Type C ; 1 x RS485
| MODEL | NXP-HAI03 |
|---|---|
| CPU | NXP i.MX8M Plus (Quad core) ARM Cortex-A53 processor up to 1.8 GHz (NEX-8MP) |
| GPU | Vivante GC700UL GPU (NEX-8MP) |
| System Memory | LPDDR4 4GB / 8GB (NEX-8MP) |
| Storage | 32 GB eMMC 5.1 ; (NEX-8MP), expandable to 256GB ;
1 x Micro SD |
| Display | 1x Mini HDMI® |
| AI Accelerator | Onboard Hailo-8™ AI processor |
| LAN | 2 x GbE (RJ45) |
| USB | 1 x USB 3.0 Type A, 1 x USB 3.0 Type C |
| Serial IO | 1 x RS485 (internal) |
| Camera | 2 x MIPI-CSI |
| DI/O | 2DI / 2DO |
| OS Support (NEX-8MP) | Yocto |
| Power Input | Wide Range DC-IN 9-24V |
| Dimension | NEX-003: 60 x 86 mm (NEX-8MP: 58.42 x 58.42 mm) ; Weight: 46g |
| Operation Temperature | -40°C~65°C (100 % CPU Usage) |
| Operation Humidity | 5~95%, non-condensing |