3I170HW
VGA,HDMI,LVDS, 5 x Intel Gb Ethernet, 9 x USB,
8 DI/8DO, 2 x COM, 1 x Mini PCIe,1xSIM,1 x M.2, SMBus
概览
LEX SYSTEM 3I170HW SBC 配备第 6 代/第 7 代 Intel® Core™ i3/i5/i7 和 Celeron® 处理器(以前的 Skylake-S /Kaby Lake-S)为用户提供快速、方便和简化的工业和嵌入式应用解决方案。 3I170HW 配备高达 64GB 的 DDR4 SODIMM RAM 和丰富的 I/O 功能,包括 2 个 RS-232/422/485 串行端口、2 个 USB 3.0 和 7 个 USB 2.0 端口。 3I170HW 还提供显示端口的灵活性,包括 HDMI、LVDS 和 VGA。用户还可以利用 3I170HW 的可扩展性,带有 1 个 mPCIe 插槽、1 个 M.2 B key Type 2242 插槽和 1 个 SIM 卡插槽扩展。采用全晶圆 IO 设计的 3I170HW 为扩展功能提供了高度的灵活性,宽电压输入 (9-36V) 以及支持的宽工作温度,还为用户提供了将 SBC 板集成到各种机械机箱的无忧解决方案,以实现许多可靠性和移动受限的嵌入式应用,例如自动化控制、运输、军事和 IP 监控解决方案。
特点
- 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S, i7 / i5 / i3 / Celeron CPU
- Intel® Q170 chipset
- 2 x DDR4 1866 / 2133 MHz SODIMM, Max. 64GB
- Multiple Independent display: VGA, HDMI & LVDS
- 5 x Intel GbE LAN, 2 x USB 3.0, 7 x USB 2.0
- 2 x COM, 8DI / 8DO, 1 x Mini PCIe, 1 x SIM, 1 x M.2, SMBus
- TPM 2.0
MODEL | 3I170HW |
---|---|
CPU Type | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S, i7 / i5 / i3 / Celeron CPU |
MB Chipset | Intel® Q170 chipset |
Graphics | Intel® HD Graphics, Support DirectX 12 & OpenGL 4.4 / 4.5 |
System Memory | 2 x DDR4 1866 / 2133 MHz SODIMM, Max. 64GB |
Storage | 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s) 1 x mini card socket for mSATA 1 x M.2 B Key, Type 2242 (SATA / PCIe) |
BIOS | AMI UEFI BIOS |
Display | 1 x VGA, 1 x HDMI, Dual Channel, 48 bits LVDS |
Touch | USB touch screen controller |
TPM | TPM 2.0 |
LAN | 1 x Intel GbE I219LM (internal), 4 x Intel GbE (internal) |
Audio (OEM) | High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier |
Expansion Interface | 1 x Full size Mini PCIe (PCIe / mSATA / USB) 1 x M.2 B Key, Type 2242 (SATA / PCIe) 1 x SIM |
Expansion Module |
Converter Card : CN066 : Mini PCIe to M.2 E key 2230, WiFi 6 + BT Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video |
USB | 2 x USB 3.0 (internal) ; 7 x USB 2.0 (internal) |
USB Expansion | USB to COM, Mini Card, M.2, Audio board |
Serial IO |
2 x RS232 / 422 / 485 (internal) *COM1, COM2 pin9 5V / 12V selectable by jumper |
GPIO | Hardware digital Input & Output, 8 x DI / 8 x DO |
SMBus | 1 x SMBus |
WDT | Hardware Watch Dog Timer, 0~255 sec programmable |
PS2 KB / MS | PS2 KB / MS (internal) |
Power Input | Wide Range +9~36V |
Dimension | 160 x 122 mm |
Operation Temperature (100 % CPU Usage) |
-20°C~70°C (Core i7 6700TE) |
Operation Humidity | 5~95%, non-condensing |
MTBF | 45℃ @ >100,000Hr |
OS Support |
7th Generation Intel® Core™ Processor family: Kaby Lake Windows® 10 IOT (64bit), 6th Generation Intel® Core™ Processor family: Skylake Windows® 10 IOT (64bit), Windows® 8.1 (64bit), Windows® Embedded 8 Standard (64bit), Windows® 7 (64bit), Windows® Embedded Sta 7 (64bit), |
Chassis (OEM I/O Expansion by request) | IP66 / 67 waterproof Box PC, IP66 / 67 waterproof PPC |