CI170C
DP, DVI, HDMI, LVDS, Touch, 5 x Intel Gb Ethernet, 9 x USB, M.2,
10 x COM, 8DI / 8DO, 2 x Mini PCIe,1 x PCIe, 2 x SIM, SMBus
Overview
LEX SYSTEM CI170C is built to provide performance computing, powered by 6th/7th Generation Intel® Core™ i3/i5/i7 and Celeron® processors (formerly Skylake-S /Kaby Lake-S) with greater processor performance than the previous generation. CI170C combines this processing power with up to 64GB of DDR4 SODIMM RAM and rich compliment of I/O features, including 10 x RS-232/422/485 serial ports, 5 x 10/100/1000 Mbps Ethernet ports, 4 x USB 3.0 and 5 x USB 2.0 ports. The CI170C also offers flexibility with display ports, featuring HDMI, DP ,DVI and LVDS. Users can also make use of the expandability of the CI170C with two full-sized mPCIe slot, and one PCIe x 16 golden finger expansion. The standout features of CI170C makes it as an ideal platform for high performance applications in edge to cloud , IoT, Smart Factory, motion control, Smart Transportation and gaming machines, automation, military & industrial facilities.
Features
- 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S, i7 / i5 / i3 / Celeron CPU
- Intel® Q170
- 2 x DDR4 1866 / 2133 MHz SODIMM, Max. 64GB
- Multiple Independent display: DP, DVI, HDMI & LVDS
- 5 x Intel GbE LAN, 4 x USB 3.0, 5 x USB 2.0, 8DI / 8DO
- 10 x COM, 2 x Mini PCIe, 1 x PCIe, 2 x SIM, SMBus
- TPM 2.0
MODEL | CI170C |
---|---|
CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S, i7 / i5 / i3 / Celeron CPU |
MB Chipset | Intel® Q170 |
Graphics | Intel® HD Graphics, Support DirectX 12 & OpenGL 4.4 / 4.5 |
System Memory | 2 x DDR4 1866 / 2133 MHz SODIMM, Max. 64GB |
Storage | 4 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s) 1 x mini card socket for mSATA 1 x M.2 B Key, Type 2242 (mSATA / PCIe) |
BIOS | AMI UEFI BIOS |
Display | 1 x DP, 1 x DVI, 1 x HDMI, Dual Channel, 48 bits LVDS or eDP |
Touch | USB touch screen controller |
TPM | TPM 2.0 |
LAN | 1 x Intel GbE I219LM (internal) 4 x Intel GbE (external) |
Audio (OEM) | High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier |
Expansion Interface | 1 x Full size Mini PCIe (PCIe / mSATA / USB) 1 x Full size Mini PCIe (PCIe / USB) 1 x PCIe 16x / 8x / 4x / 1x golden finger 1 x M.2 B Key, Type 2242 (mSATA / PCIe) 2 x SIM |
Expansion Module |
Converter Card : CN066: Mini PCIe to M.2 E key 2230, WiFi 6 + BT Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card |
USB | 4 x USB 3.0 (external), 5 x USB 2.0 (internal) |
USB Expansion | USB to : COM, Mini Card, M.2, Audio board |
Serial IO |
4 x RS232 / 422 / 485 (external) *COM1~COM10 pin9 5V / 12V selectable by jumper |
GPIO | Hardware digital Input & Output, 8 x DI / 8 x DO |
SMBus | 1 x SMBus |
WDT | Hardware Watch Dog Timer, 0~255 sec programmable |
PS2 KB / MS | PS2 KB / MS (internal) |
Power Input | DC IN +12V |
Dimension | 207 x 150 mm |
Operation Temperature (100 % CPU Usage) |
-20°C~70°C (Core i7 6700TE / i7 6700) |
Operation Humidity | 5~95%, non-condensing |
MTBF | 45℃ @ >100,000Hr |
OS Support |
7th Generation Intel® Core™ Processor family: Kaby Lake Windows® 10 IOT (64bit), 6th Generation Intel® Core™ Processor family: Skylake Windows® 10 IOT (64bit), Windows® 8.1 (64bit), Windows® Embedded 8 Standard (64bit), Windows® 7 (64bit), Windows® Embedded Sta 7 (64bit), |
Chassis (OEM I/O Expansion by request) | Box PC: TWISTER, TINO, 1U / Fanless 15" / 17" PPC |