ARM-based SBC
NXP-HAI02
Overview
The LEX SYSTEM NXP-HAI02 redefines embedded computing with the NXP i.MX 8M Plus and Hailo-8™ AI processors, delivering up to 26 TOPS of AI performance for edge applications. It features Mini HDMI®, 8GB LPDDR4 memory, 32–256GB eMMC, Micro SD, and dual MIPI-CSI for camera input.
Equipped with industrial-grade I/O interfaces, including 1 x GbE LAN (M8 I/O), USB 3.0, and 1 x RS232 + DIO (M8 I/O), and is designed with a wide 9– 24V power input (M8 I/O) to support demanding applications. NXP-HAI02’s modular architecture streamlines the development process, reduces time-to-market, and optimizes costs. Built to excel in demanding environments, the NXP-HAI02 is the ultimate solution for applications requiring reliable and high-performance edge computing, such as object detection, image recognition, and predictive maintenance.
Features
- NXP i.MX8M Plus (Quad core) ARM Cortex-A53 processor up
to 1.8 GHz - LPDDR4, 8GB
- 32GB eMMC 5.1, option 64 / 128 / 256GB ; 1 x Micro SD
- Onboard Hailo-8™ AI processor ; 2 x MIPI – CSI
- 1 x Mini HDMI® ; 1 x GbE (M8 I/O) ; 1 x USB 3.0 Type A,
- 1 x USB 3.0 Type C ; 1 x RS485 (M8 I/O)
MODEL | NXP-HAI02 |
---|---|
CPU | NXP i.MX8M Plus (Quad core) ARM Cortex-A53 processor up to 1.8 GHz |
GPU | Vivante GC700UL GPU |
System Memory | LPDDR4 8GB |
Storage | 32GB eMMC 5.1 ; option 64 / 128 / 256GB ; 1 x Micro SD |
Display | 1 x Mini HDMI® |
AI Accelerator | Onboard Hailo-8™ AI processor |
LAN | 1 x GbE (M8 I/O) |
USB | 1 x USB 3.0 Type A, 1 x USB 3.0 Type C |
Serial IO & DI/O | 1 x RS485 + 2DI / 2DO (M8 I/O) |
Camera | 2 x MIPI – CSI (Support Basler MIPI Camera & Sony MIPI Camera) |
OS Support | Yocto |
Power Input | Wide Range DC-IN 9-24V (M8 I/O) |
Dimension | 60W x 86D x 20.08H mm (NEX-8MP: 58.42 x 58.42 mm) |
Operation Temperature | -40°C~65°C (100 % CPU Usage) |
Operation Humidity | 5~95%, non-condensing |